HIR Literature Review

Chip Level Integration
PRESENTATION

Chip Level Integration

The fundamentals of chip design, from functional and logic design using HDL to physical implementation with GDSII for photomask creation....

November 14, 2024
Hybrid Bonding
PRESENTATION

Hybrid Bonding

An overview of various interconnect technologies culminating in an introduction to Hybrid Bonding.

November 07, 2024
Yield and Metrology
PRESENTATION

Yield and Metrology

An introduction to yield and the strategies producers use to improve it, along with the trade-offs involved. These key concepts...

October 31, 2024
Processing Memory Bottleneck
PRESENTATION

Processing Memory Bottleneck

An exploration of the growing disparity between processing and memory speeds, the escalating demand for memory and power driven by...

October 24, 2024
Back Side Power Delivery
PRESENTATION

Back Side Power Delivery

An analysis of Back Side Power Delivery as an innovative approach to powering transistors, introducing the challenges it aims to...

October 17, 2024
Single and Multi Chip Integration
PRESENTATION

Single and Multi Chip Integration

A discussion on the driving factors behind the shift to the chiplet economy, along with the challenges encountered in implementing...

October 10, 2024
Thermals
PRESENTATION

Thermals

The essentials of thermal management in electronics, focusing on thermal basics, design considerations, and simulations.

September 26, 2024
MOSFET Creation
PRESENTATION

MOSFET Creation

An overview of MOSFET transistors and an in-depth look into their creation process.

September 12, 2024
Heterogeneous Integration Overview
PRESENTATION

Heterogeneous Integration Overview

An introduction to our chapter and a brief lecture on semiconductor packaging as well as heterogeneous integration.

September 05, 2024

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