Skip to content
Resources
Presentation

BEOL and Packaging

A visualization and overview of the MEOL and BEOL, before detailing the development of some interconnect technologies within those layers.

The slide file is currently unavailable.

Ready to Engage with the RPI IEEE Community?

Join our quest to foster innovation and collaboration in the field of engineering. Together, we'll explore, discover, and innovate.

Join Now

Enrich Your Engineering Network

Access workshops, seminars, and resources to fuel your passion.

Lead, volunteer, and grow with opportunities at RPI and beyond.