2nd Mini Colloquium on Semiconductor Technology Evolution

Speakers

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  Mark Poliks

  Printing, Placing and Interconnecting Electronic Functions On Available Surfaces: Enabling Hybrid and Additive Approaches To Medical and Industrial Devices

  Distinguished Professor of Materials Science and Engineering and Systems Science and Industrial Engineering at the Thomas J. Watson College of Engineering and Applied Science, Binghamton University

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  John H. Lau

  Flip Chip Technology – Solder Bumps, Microbumps, and Bumpless Cu-Cu Hybrid Bonding

  IEEE Fellow, IMAPS Fellow, ASME Fellow, Senior Packaging Engineer at Unimicron

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  Rajiv V. Joshi

  Invaluable Memories

  IEEE Life Fellow, IEEE Daniel Noble Award Winner, Vice President of Industry for IEEE Circuits and Systems Society, Research Scientist at IBM T. J. Watson Research Center

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  Andreas Kerber

  Reliability of Metal Gate / High-K CMOS devices

  IEEE Senior Member, IEEE Electron Devices Society Distinguished Lecturer, CMOS Reliability Expert at Intel