| ECSE-6300 Fab Lab Course Calendar, Spring 2024 | |||||||||||||
| Week | Lecture | Action/Process Steps | Lab | HWs | Quiz | ||||||||
| 1 | 1. Introduction / | No Lab | - | - | - | ||||||||
| 8-Jan | Safety | Course Organization | |||||||||||
| 11-Jan | 2. Thermal Oxidation + SUPREM | ||||||||||||
| 2 | MLK Day, no lecture | Field Oxidation | 1 | 1 | 1 | ||||||||
| 15-Jan | |||||||||||||
| 3 | 3. Photolithography | M1 Active Area: Photolithography & Oxide Wet Etch | 2 | 2 | |||||||||
| 22-Jan | |||||||||||||
| 4 | 4. Dielectrics and Poly-Si | Gate Oxidation, Poly-Si Deposition and Doping; | 3 | 3 | |||||||||
| 29-Jan | Deposition | ||||||||||||
| 5 | 5. Ion Implantation | M2 Poly-Si Gate: Poly-Si/Oxide Etch, S/D Ion Implantation (@ Vendor) | 4 | 2 | 4 | ||||||||
| 5-Feb | |||||||||||||
| 6 | 6. Diffusion in Si | ILD Deposition and Densification & Implant Activation | 5 | 5 | |||||||||
| 12-Feb | |||||||||||||
| 7 | 7. Plasma-Assisted Etching | "M5" Contacts: | 6 | 6 | |||||||||
| 20-Feb | (Tuesday) | ILD RIE Etch for Contacts | |||||||||||
| 8 | 8. Metallization | Al/Si Contact - Sputtering Deposition | 7 | 3 | 7 | ||||||||
| 26-Feb | |||||||||||||
| 9 (3/4) | Spring Break | ||||||||||||
| 10 | 9. MOSFET | "M6" Metallization: Al/Si Wet Etch | 8 | ||||||||||
| 11-Mar | |||||||||||||
| 11 | 10. Device Characterization | Etch Backside | 9 | 4 | 8 | ||||||||
| 18-Mar | Deposit Al/Si on Back, Sinter | ||||||||||||
| 12 (3/25) | None | Device Testing | |||||||||||
| 13 (4/1) | None | Device Testing | |||||||||||
| 14 (4/8) | None | Device Testing | |||||||||||
| 15 (4/15) | None | Device Testing | |||||||||||
| 16 (4/22) | Poster Competition | Final Report Due | |||||||||||